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This new material is included within the Brewer Science product family of PermaSOL materials designed to address device- and wafer-level packaging requirements.
January 27, 2020
By: Anthony Locicero
Copy editor, New York Post
Brewer Science, Inc. introduced its first material for permanent bonding from the European 3D & Systems Summit. This new material is included within the Brewer Science product family of PermaSOL materials designed to address device- and wafer-level packaging requirements. The new material addresses a range of needs identified for permanent bonding applications, which include low-temperature bonding, extreme chemical resistance, UV or thermal curable bonding process, and no material movemen...
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